VitroCoat GI®
The adhesion promoter for plating on glass
Unparalleled
Metallization coverage in high aspect TGV
Finer l/s Cu trace formation on glass
Superior adhesion
After industry standard reliability testing
- Plating on glass enabled by an ultra thin metal oxide adhesion promoter
- Lower CAPEX and running cost when compared to competing processes, such as sputter
- Applicable for panel as well as wafer scale
- Single seed etching process resulting from Cu only seeding
Cu patterning on glass wafer with VitroCoat GI®
- Enables finer l/s Cu trace formation directly on glass
- Excellent adhesion of plated Cu-film to glass with uniform surface distribution
- Superior through-hole side-wall coverage with excellent adhesion
- Applicable for panel as well as wafer scale
- Sustains good adhesion after reliability testing
- No electro-migration (B-HAST)
- Lower CAPEX and running cost compared to competing processes
What inspires us
Why we developed VitroCoat GI®
Your challenge
The ideal material properties of Glass (scalability, high resistivity, low warpage, smooth surface) make it a key new substrate for advanced PKG.
Unfortunately, plated Copper does not adhere directly to glass without a capable adhesion promoter.
The major challenge is to provide a cost competitive, high throughput and reliable metallization for both TGV and smooth glass with excellent adhesion.
Our solution
VitroCoat GI® is an ultra thin metal oxide adhesion promoter enabling plating on glass.
VitroCoat GI® enables usage of electroless Cu for seeding and semi-additive processes with your EQP.
Unparalleled coverage in high aspect ratio through-vias
Atotech’s VitroCoat GI is a new and innovative adhesion promoter that enables wet chemical metal deposition on glass. It can be applied using a short, simple, cost effective dip-coating method.
VitroCoat GI’s key advantage is unparalleled coverage in high aspect ratio through-vias versus competing processes such as PVD.
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