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and direct plating process solutions

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Printoganth® MV TP2

Next Generation Electroless Copper for Fine Line SAP Applications

Excellent throwing power

Consistently achieved in BMVs with challenging dimensions

Production ready – Fast

Quick bath initiation with low dummy plating

Mixed production capability

Low deposition thickness supports fine line & high frequency applications

Printoganth® MV TP2 has been optimized to give high throwing power into blind micro vias, including the wedge, while its low deposition thickness enables fine lines and spaces of 10 μm and less. With a low bath initiation and dummy requirement, in combination with a viable stable analysis method for enhanced process control, makes Printoganth MV TP2 the only solution for high volume SAP applications, or manufacturers where the ability to switch between amSAP and full SAP is desirable.

  • High-end IC substrates based on SAP technology
  • IC substrates using amSAP technology

  • Ideal for mixed production facilities targeting SAP with amSAP
  • Excellent throwing power into challenging BMVs
  • Reduced process costs due to low dummy plating
  • Low bath initiation: 0.2 dm² c.b./L for 10min
  • Bath loading factor: ≥ 0.1 dm² c.b./L/li>
  • Thin deposit (0.25 μm) with controlled levelling characteristics supports fine line & high frequency applications/li>
  • Stabilizer analysis available for improved process control/L/li>

What inspires us

Why we developed Printoganth® MV TP2

Your challenge

The next generation of IC substrates require finer line and spaces features than existing designs, and in order to achieve this, surface Copper thickness must be minimized. Contradictorily, the Copper thickness within micro vias has to be maximized to ensure coverage for subsequent pattern plating operations. In addition, “high frequency” applications require a uniform deposit thickness with optimal roughness to enhance dry film adhesion, which is also critical for fine line SAP manufacturers.

Our solution

Printoganth® MV TP2 is Atotech’s most upto date solution for meeting the miniaturization requirements that are cascading down from the semiconductor arena, and into the high-end IC Substrate market. Printoganth® MV TP2 offers superior throwing power performance, with a low deposition thickness that opens up the next stage in feature size reduction.
With an optimized deposit structure, Printoganth MV TP2 creates a uniform textured Copper layer that is ideal for low loss applications and enhanced dry film adhesion.

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