Xenolyte®
Electroless plating solutions for pad and under bump metallization and RDL housing
Robust and stable
adhesion between pad and IC substrate
Qualified
according to Automotive Spec AEC – Q100-010 RE
Low CoO
compared to sputtering technologies
- Electroless deposition of Ni, Pd, Au and Sn
- Compatible with Al, Cu, AlCu and AlSiCu surfaces
- No pad splashing for Cu wire bonding
- Corrosion free and stress minimized protection of underlying interconnects
- Pure Pd deposition
Compared to most competitive products Xenolyte® has a high reliability due to the pure Pd deposition and is qualified according to automotive specification (AEC Spec Q 100-10 RE) which makes the process a unique solution for power chips and the automotive industry.
- IGBTs
- MOSFETs
- Power IC
- Memory
- Image sensors
With Xenolyte®‘s proven technologies, the following process and deposition requirements are satisfied at significantly lower costs compared to traditional sputtering technology:
Ni
- Effective diffusion barrier
- Lead free electrolyte conforms to RoHS
- Low stress
- Fast deposition rate
- Low, mid, and high phosphorous electrolytes available
Pd
- Pure Pd deposit
- Long bath life
- Reduced cost of ownership
- Excellent reliability at high temperatures
- Improved shear strength
Au
- Immersion process
- Improved corrosion stability
- Cyanide free solution conforms to RoHS
- Low temperature process
Sn
- Methane sulfonic acid based
- Improved adhesion promotion between Cu and organic material
- Fast deposition rate
- Low temperature process
- Immersion process
A clear goal
The Xenolyte® portfolio is cyanide and lead free, conforms to RoHS (EU guideline on the Restriction of Hazardous Substances), and enables environmentally responsible green technology solutions.
Atotech’s pad metallization process
The Xenolyte® portfolio includes cleaning and activation, pre-treatment, and plating chemistries for the electroless deposition of nickel, palladium and gold.
- Cleaning
- Etching
- Activation for Al, Cu, AlCu and AlSiCu surfaces
- Ni: Diffusion barrier to protect underlaying actives and prevent formation of Kirkendall voids
- Pd: Protection against oxidation and perfect surface finish for wire and wedge bonding
- Au: Protection against oxidation and perfect surface finish for soldering
Why we developed Xenolyte®
Your challenge
Stable and reliable Pd deposition at high throughput is one of the key requirements to reduce the costs of the entire under bump metallization process.
Our solution
Our Xenolyte® Pd is a unique solution for enabling a pure Pd deposition, which results in high reliability and outstanding bath life performance.
Image gallery
Xenolyte® for wire bonding
Xenolyte® for wedge bonding
Xenolyte® for soldering
Xenolyte® for RDL housing
Contact us