Xenolyte® processes
Cleaning and activation pre-treatment and plating solutions for the electroless deposition of nickel, palladium, and gold in RDL housing and
pad metallization applications.
Universal electroless deposition
Compatible with nickel, palladium, and gold systems for a wide range of wafer types.
Eco-friendly chemistry
Cyanide- and lead-free, fully compliant with RoHS guidelines.
Automotive-grade reliability
Qualified to AEC-Q100-010 RE for high-performance, long-term stability.
Wire bonding, soldering and RDL housing.
Xenolyte processes represent our comprehensive portfolio of cleaning, activation, and plating solutions for the electroless deposition of nickel, palladium, and gold. The processes enable the formation of hard, corrosion-resistant, and stress-minimized metal stacks, protecting active semiconductor structures and ensuring reliable electrical connections between chip pads and IC substrates.
Xenolyte processes also include Zincate CFA2, a universal acidic zincation process for aluminum and aluminum alloy wafers. This pretreatment removes native oxide layers and replaces them with a uniform zinc coating, creating the ideal surface for subsequent nickel deposition. Its compatibility with all solder mask and resist types ensures flexibility across diverse semiconductor applications.
- MEMS devices
- Controllers and logic ICs
- Power semiconductors (IGBTs, MOSFETs, diodes)
- Memory chips (DRAM, NAND)
- Image sensors
- RDL housing and wafer-level packaging
Standard and Universal Al zincation processes.
- Hard, corrosion-free, and stress-minimized metal layers for enhanced device protection
- Uniform and defect-free zincation across all Al and Al alloy wafers
- Full compatibility with all solder masks and resist systems
- Excellent solder joint performance with low-resistance connections
- No silver migration and no volatile or harmful ingredients
- Significant cost savings compared to sputtering-based metallization
- Cyanide- and lead-free chemistry that reduces environmental impact
- RoHS-compliant design aligned with global sustainability standards
- Proven performance in demanding automotive-grade applications
- Stable, repeatable plating processes for high-yield semiconductor production
What inspires us
Why we developed Xenolyte processes
Your challenge
As semiconductor devices become smaller and more complex, manufacturers face increasing pressure to achieve uniform, reliable metallization across a broad range of materials and wafer designs. Traditional sputtering and plating methods often fall short in maintaining performance, cost efficiency, and environmental compliance at high production volumes.
Our solution
We developed Xenolyte processes to meet these challenges with chemically robust, sustainable electroless deposition systems. By combining advanced pretreatment technologies such as Zincate CFA2 with finely tuned nickel, palladium, and gold plating chemistries, Xenolyte ensures exceptional adhesion, uniformity, and reliability – all while reducing process costs and minimizing environmental impact.