BondFilm® LDD MSAP
LDD Pre- and Posttreatment
Enables
lower drilling energy
Improves
drilling performance
Cleans
laser burr to craft a perfect result
BondFilm® LDD
Our industry proven pretreatment for laser direct drilling.
BondFilm® LDD helps to boost the drilling performance Co2 lasers by preparing the surface in order to increase the laser energy intake and preventing the copper surface acting like a heatsink.
BondFilm® LDD generates a specifically roughened surface with an etch depth of about 0.8-1.4 µm. It creates an organometallic adlayer that improves the surface morphology to decrease backscattering of the laser beam. BondFilm® LDD contains special additives that leaves the surface free of smut and assures a long lifetime of the bath and the final product.
- Specifically developed low-etch depth LDD pretreatment process for needs of advanced mSAP manufacturers
- Ideally suited for conveyorized application – matched chemistry and equipment with Atotech’s Horizon® system
- Combined with non-etching posttreatment BondFilm® LDD MSAP Enhancer for best PTH preparation
Top: No via opening achieved without pretreatment on 3 μm copper foil, bottom: 63.1 μm via opening achieved with BondFilm® LDD MSAP pretreatmenton 3 μm copper foil
- Tailor-made LDD pretreatment product for the needs of advanced mSAP manufacturers
- Improved Laser absorption at low etch depth of 0.5 µm
- Ideally suited for conveyorized application – matched chemistry and equipment with Atotech’s Horizon® system
- Combined with non-etching posttreatment BondFilm® LDD MSAP Enhancer for best PTH preparation
- Improved, reliable via formation with reduced copper splash
What inspires us
Why we developed BondFilm® LDD MSAP
Your challenge
In order to move your HDI production to the next level you have to adopt new manufacturing methods such as mSAP. This also means that the copper substrate thickness before LDD pretreatment is significantly thinner than before. At the same time the requirements on your LDD process are increasing to create smaller vias in a reliable manner.
Our solution
BondFilm® LDD MSAP is a low-etch depth pretreatment that allows for significantly improved laser absorption at only 0.5 µm etch depth. It allows to increase the efficiency of the LDD production step whilst minimizing the copper removal and therefore enabling the handling of thinner copper materials that are needed in mSAP manufacturing.
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