BondFilm® LDD MSAP
LDD pretreatment for advanced mSAP applications
Improved efficiency
of laser absorption at low etch depth of 0.5 µm
Available as complete system
with Atotech Horizon® process equipment
Combined
with non-etching LDD post-treatment BondFilm® LDD MSAP Enhancer
BondFilm® LDD MSAP
Low etch depth LDD pretreatment
BondFilm® LDD MSAP is a simple low-temperature process that prepares the surface for laser direct drilling at the very low etch depth of 0.5 μm. It is ideally suited to conveyorized application for thin material handling such as copper foils used for mSAP build ups. The process roughens the copper surface and deposits a brown organo-metallic conversion coating on the surface.
Those surface changes increase the efficiency of the laser absorption and minimize negative effects such as copper splash. This allows for reliable, better via formation while employing a lower laser energy than without or with other competitive pretreatments.
The process can be combined with Atotech Horizon® equipment for optimal results. In combination with the non-etching BondFilm® LDD MSAP Enhancer posttreatment this process perfectly prepares the treated boards for optimal results in subsequent PTH plating steps.
- Specifically developed low-etch depth LDD pretreatment process for needs of advanced mSAP manufacturers
- Ideally suited for conveyorized application – matched chemistry and equipment with Atotech’s Horizon® system
- Combined with non-etching posttreatment BondFilm® LDD MSAP Enhancer for best PTH preparation
Top: No via opening achieved without pretreatment on 3 μm copper foil, bottom: 63.1 μm via opening achieved with BondFilm® LDD MSAP pretreatmenton 3 μm copper foil
- Tailor-made LDD pretreatment product for the needs of advanced mSAP manufacturers
- Improved Laser absorption at low etch depth of 0.5 µm
- Ideally suited for conveyorized application – matched chemistry and equipment with Atotech’s Horizon® system
- Combined with non-etching posttreatment BondFilm® LDD MSAP Enhancer for best PTH preparation
- Improved, reliable via formation with reduced copper splash
What inspires us
Why we developed BondFilm® LDD MSAP
Your challenge
In order to move your HDI production to the next level you have to adopt new manufacturing methods such as mSAP. This also means that the copper substrate thickness before LDD pretreatment is significantly thinner than before. At the same time the requirements on your LDD process are increasing to create smaller vias in a reliable manner.
Our solution
BondFilm® LDD MSAP is a low-etch depth pretreatment that allows for significantly improved laser absorption at only 0.5 µm etch depth. It allows to increase the efficiency of the LDD production step whilst minimizing the copper removal and therefore enabling the handling of thinner copper materials that are needed in mSAP manufacturing.
Image gallery
BondFilm® LDD MSAP: Advanced LDD pretreatment at low etch depth of 0.5 µm
BondFilm® LDD MSAP, stable performance along the copper loading
BondFilm® LDD MSAP full process flow
BondFilm® LDD MSAP, fully compatible with Atotech Horizon equipment
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