BondFilm® EX-S2
Low roughness bonding enhancement
solution for high-frequency applications
Signal transmission
Great SI performance due to reduced roughness and minimum line width reduction
Reliability
Great adhesion performance, thermal reliability and process control
Cleanliness
Creates 90% less sludge than other competing processes
BondFilm® EX S-2
Advanced adhesion enhancement promoter, engineered specifically for next-generation PCB designs. It provides a superior bonding interface while preserving copper integrity—an essential factor for high-frequency performance.
As high-frequency PCB applications continue to push the limits of signal performance and thermal reliability, traditional bonding enhancement processes are reaching their limits. To meet the demands of advanced RF and high-speed digital applications, manufacturers require an adhesion promoter that can deliver robust performance without compromising signal integrity.
Unlike conventional oxide and oxide alternative processes that rely on deeper copper etching to achieve adhesion, BondFilm® EX-S2 delivers excellent adhesion with minimal copper removal. This results in a significantly smoother copper surface, which helps reduce conductor loss and improves signal transmission—key for applications in 5G, automotive radar, and high-speed computing.
BondFilm® EX S-2 is a future proof process that can be used for HDI PCBs such as in flagship smartphones, in the automotive sector, for telecommunication and network devices. It is compatible with a wide range of low loss dielectric materials.
- Compatible with a wide range of high-performance materials for low SI loss application
- Minimal copper reduction (0.3 – 0.5 μm)
- Smooth interface Ra < 250nm
- Significant improvement of signal integrity > 8% lower SI loss than conventional processes
- High and consistent peel strength after thermal
stress
What inspires us
Why we developed BondFilm® EX S-2
Your challenge
In response to the evolving demands of high-frequency PCB applications such as those used in 5G, RF, and advanced computing, we identified a growing limitation in conventional bonding enhancement processes. These traditional methods often rely on aggressive copper etching to ensure adhesion, which results in rough copper surfaces and compromised conductor geometry. This roughness contributes to higher signal loss, posing significant challenges for applications where signal integrity and thermal reliability are critical. Moreover, with the increasing adoption of low-loss dielectric materials in multilayer designs, existing processes struggle to deliver consistent adhesion without negatively impacting high-frequency performance.
Our solution
To address these challenges, we developed BondFilm® EX-S2, an advanced adhesion promoter designed specifically for next-generation PCB manufacturing. BondFilm® EX-S2 delivers excellent bonding performance with an extremely low etch depth – 0.3 to 0.5 micrometers, preserving the smooth copper interface essential for high-speed signal transmission. By minimizing copper removal, it helps maintain conductor integrity while still achieving high peel strength and long-term thermal reliability. The process has demonstrated more than 8% reduction in signal loss compared to conventional oxide replacement processes, offering a measurable advantage for high-frequency designs. Compatible with a wide range of low-loss base materials and reflow cycles, BondFilm® EX-S2 sets a new standard for bonding enhancement in high-performance PCB applications.