Product portfolio
Gold
- Aurocor® HS hard gold: A product family for hard gold deposits from cobalt to iron with highest speed
- Aurocor K24 HF: Highest purity gold for excellent bonding
Silver
- Argalux® NC mod: Cyanide free hard silver-plating process
- Silvertech® RBH: Hard silver plating
- Silvertech HS: High speed Ag plating
- Silvertech® C: Silver Carbon process for reduced wear off
Nickel
- Nickel Sulphamate HS: Low stress at high-speed nickel plating
- Novoplate™ HS: High speed electrolytic nickel phosphorous process for perfect corrosion resistance
- Novoplate® NiW: Nickel-Tungsten plating process for most advanced consumer electronics
- Pallacor HSN Plus: Superior Pd/Ni layers with exceptional alloy uniformity and corrosion resistance
Copper
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- Cupracid® LED – Brightest deposit: Extremely high levelling capacity to maximize reflectivity e.g. for LED lead frames
- Cupracid® FEC Plus – High speed copper: Depostion for connectors, cables and more with ductile Copper
- Cupracid® 380 – Simply bright: High reliability and high levelling capacity combined for LEDs and more
- Cupracid® Matt: Improves the adhesion of molds etc.
Tin
- Stannolume® WP: Sulfuric acid based bright tin
- StannoPure® HSB: Best bright tin in the market
- Stannacid® HS-N: Semi-bright tin process based on sulfuric acid
- StannoPure® PF 10: Green high speed tin process for lead frames and connectors with perfect coverage
- Niveostan®: A product family for semibright, pure and large grained tin deposits
Adhesion Promoter
- MoldPrep HMC: Ultimate adhesion enhancer for MSL improvement
- AgPrep: Ultimate non etching adhesion promoter for silver surfaces
- ppfPrep: New NEAP assures excellent adhesion and significant cost savings
Anti-Tarnishes
- SuperDip® Cu 1000: Effective and versatile Copper anti-tarnish
- Protectostan® Plus 3: High performance “2-in-1” and PFAS free tin post-dip
- Betatec® E: The most effective sustainable anti-tarnish for more than gold
- Argalin® XL: High performance inorganic and Cr(VI)-free silver anti-tarnish