Providing electrolytes for the highest requirements


in reliability and productivity

Inpulse® 2THF2

Inclusion-free through hole filling with horizontal equipment


The patented Bridge-Plating provides the only solution for inclusion-free through hole filling

One process for all

For inclusion-free filling of mechanical and laser drilled vias

Matched with Atotech’s systems

Best chemistry and equipment fit with Atotech’s Uniplate systems

2-step bridge plating with Inpulse® 2THF2 enables inclusion-free through hole filling

Inpulse® 2THF2 together with the unique Uniplate® InPulse2 horizontal reverse pulse plating systems is ideally suited for through hole filling, e.g. for core material. It is also crucial for 5G application, where thermal heat dissipation is necessary. It is the only available inclusion-free copper through hole filling in the market. The unique process creates an X-shape during the first step, building up two BMVs. Together with the subsequent BMV filling in the second step, this process grants reliable filling at the lowest possible surface thickness. Our latest generation process now enables void-free THF filling for ARs up to 3:1.

  • High thermal conductivity for heat transfer, e.g. for 5G application
  • Void-free THF filling now for ARs up to 3
  • Potential to replace coining process
  • Low cost through hole filling due to elimination of conventional process steps
  • Improved dimensional stability of substrates
  • Boosting reliability results like Hot Oil, IST, TCT,…
  • Ideally suited for conveyorized application – matched chemistry and equipment with Atotech’s Uniplate® system
  • Full panel plating for best possible plated copper surface distribution
  • Pulse plating at high effective current densities with insoluble anodes

Inpulse® 2THF2: Inclusion-free copper filling of through holes on flex material

  • Inpulse® 2THF2 enables inclusion-free copper filling of through holes
  • Reliable plugging / filling technology for thin core material as well as for high aspect ratio through holes up to 3:1
  • Low surface plated copper with dimple less than 10 μm
  • Capable for mechanical and also laser drilled through holes
  • Excellent surface uniformity
  • Economical process savings in: copper metal, solder mask, etching process and processing time
  • Meets all reliability standards

What inspires us

Why we developed Inpulse® 2THF2

Your challenge

Paste plugging process for through holes requires additional process steps, each of which has its own limitations and contributes to the overall cost. Complete Through Hole filling for cores by a copper electroplating process is needed as an alternative. Inclusion free through hole filling is required to overcome the risk of migration of inclusion by applying current and heat during use of final product. This migration may lead to a delamination/ separation of the interface connection to the next layer.

Our solution

Inpulse® 2THF2 is the world’s only inclusion-free plating process for through hole filling enabled by our patented Bridge-Plating technology. It has been proven in mass production for > 10 years. The combination of the Inpulse® 2THF2 process together with the Uniplate® InPulse2 system provides unsurpassed surface distribution in panel plating. In combination with Atotech’s patented Superfilling® technology minimum surface plated copper and low dimple filling performance, leading to low cost through hole filling of TH’s for ARs up to 3:1.

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