by Markus Lehr | Mar 20, 2018 | Press releases
Coverage performance comparison vs. Neoganth® B Pre Dip on 4 different base materials (Isola IS410, Panasonic R1755C, Nanya NP140, Shengyi S1141) after new make-up, throughput and with maximum drag-in of Neoganth® W Pre Dip into the subsequent activator bath Berlin,...
by Markus Lehr | Mar 12, 2018 | Tradeshows and events
InPro® THF: Current density: 1.5 A/dm², dimple < 5μm Berlin, 13 March, 2018: Atotech confirmed to showcase its latest solutions for (a)mSAP application at the upcoming CPCA show in Shanghai, China, from March 20 through 22, 2018. The company has developed...
by Markus Lehr | Mar 7, 2018 | Press releases
Atotech’s MultiPlate® for Power IC Berlin, 6 March, 2018: Atotech announced that it will present and exhibit at Semicon China 2018 to be held in Shanghai from March 14 to 16, 2018. On Friday, March 16, from 11:30 to 11:45 am, Cassandra Melvin, Global Product Manager...
by Markus Lehr | Mar 5, 2018 | Press releases
Atotech adds Vice President HR position to the senior management team Daniel Wan will drive strategic HR initiatives and develop the HR function globally Berlin, 5 March, 2018: Atotech reinforces its strategic positioning in the HR organization by adding Daniel Wan as...
by Markus Lehr | Mar 1, 2018 | Press releases
Atotech’s revolutionary new tool called MultiPlate® for FOPLP Berlin, 28 February, 2018: At the upcoming IMAPS Device Packaging Conference 2018 next week, Atotech will speak about the move from Fan Out Wafer Level Packaging (FOWLP) to Fan Out Panel Level Packaging...
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