by Markus Lehr | Oct 12, 2018 | Press releases
Rick Nichols, Global Product Manager Surface Finishing Berlin, 12 October, 2018: Rick Nichols, Global Product Manager Surface Finishing at Atotech Group, is invited to the Surface Finish Expert Panel at this year’s SMTA conference 2018 held from October 14 to 18,... 
by Markus Lehr | Oct 8, 2018 | Press releases
MultiPlate® PLP, Atotech’s revolutionary new tool for FO-PLP Berlin, 8 October, 2018: “Upscaling panel size for copper plating on FO-PLP applications to reduce manufacturing cost” will be the topic of Atotech’s presentation at this year’s iMAPS conference, held in... 
by Markus Lehr | Sep 3, 2018 | Press releases, Uncategorized
Printoganth® RA – Shiny surface appearance after electrolytic copper plating moderated growth of copper crystals Berlin, 3 September, 2018: Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless... 
by Markus Lehr | Aug 30, 2018 | Tradeshows and events
Top: Plating fine lines, Cu pads; bottom: Microvia filling, CD < 20 µm [/et_pb_text][/et_pb_column][et_pb_column type="2_3"][et_pb_text admin_label="Chemistry solutions for enhanced reliability for 5G " text_font_size="18" border_style="solid"... 
by Markus Lehr | Jul 20, 2018 | Press releases
Berlin, 20 July, 2018: Founded in 1993, Atotech has become one of the world’s most reliable, innovative and leading total solutions providers in the surface finishing industries. Over the past year, the company has transformed into a stand-alone organization and just... 
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