by Markus Lehr | Nov 22, 2018 | Press releases
SEM micrographs of copper structure after annealing (125°C, 4h) deposited at 3 ASD with the novel chemistry Atotech, one of the leading companies worldwide in providing specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor... 
by Markus Lehr | Nov 9, 2018 | Press releases
Plating fine lines, Cu pads Atotech Group, a leading chemical and equipment supplier for PCB, semiconductor advanced packaging and dual damascene applications, will exhibit and present its latest products for power, automotive, and mobile semiconductor applications at... 
by Markus Lehr | Nov 6, 2018 | Tradeshows and events
From left: Harald Ahnert (President of Electronics, Atotech Group), Rick Wu (President, Career Technology, Co-Chair of IMPACT 2018 and Chairman TPCA), George Yang (Vice President Great China, Atotech Group), James Tsai (Business Director, Atotech Group) Harald Ahnert,... 
by Markus Lehr | Oct 22, 2018 | Press releases
Showing Atotech’s Inpulse® 2THF process performing “X-plating and BMV filling” to realize a uniform bridge plating and through hole filling – a patented plating technology by Atotech Atotech, a leading provider of chemicals and equipment for PCB, package... 
by Markus Lehr | Oct 12, 2018 | Press releases
Rick Nichols, Global Product Manager Surface Finishing Rick Nichols, Global Product Manager Surface Finishing at Atotech Group, is invited to the Surface Finish Expert Panel at this year’s SMTA conference 2018 held from October 14 to 18, 2018, at the Donald Stephenson... 
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