Leading surface technologies for

connectors, leadframes and IC outer leads

About our portfolio

Functional electronic coatings

Commitment to high-tech solutions

Quick facts

  • Full range of plating chemicals for gold alloy (nickel, iron, cobalt), palladium and palladium alloy, tin, nickel, copper, silver, rhodium, platinum and ruthenium coatings
  • Full process range for superior pretreatments and post-treatments
  • Sustainable solutions


  • Electrical and electronic applications including IC outer leads, leadframes, connectors, and interconnect devices
  • LED applications
  • Micro waveguides
  • Metal wires

Plating chemicals

IC / leadframes
Plating chemicals leadframes

Features and benefits

  • Innovative solutions for leadframe roughening, tin plating, ultrathin Ni/Pd/Au and high-speed silver plating
  • Highest MSL level performance
  • Whisker prevention
  • Low-to-zero free cyanide high-speed alternative for plating matt silver over leadframe surfaces
Plating chemicals pretreatment electric industry

Features and benefits

  • Innovative solutions for gold/gold alloy plating, palladium/palladium alloy plating, silver plating, nickel plating, tin plating and nickel gold plating
  • Pure tin layers with low internal stress, excellent solderability and minimal propensity to whisker
  • Robust systems allowing for wide variation within most significant plating parameters

Plating chemicals for connectors

Features and benefits

  • Innvoative solutions for cleaning, anti-immersion and deflashing
  • Processes for perfectly cleaned and activated metal surfaces


Plating chemicals posttreatment electronics

Features and benefits

  • Innovative solutions for anti-discoloration and anti-tarnishing, anti-corrosion, bleed-out prevention, stripper and belt stripper
  • Processes to inhibit discoloration of tin plated layers
  • Excellent wettability and solderability of tin plated surfaces after steam aging and pressure cooking

“We have carried out an extensive and methodical comparative study to evaluate and help visualize our deflashing performance. We have used the results to successfully develop the new Deflash GR1 process.”

Steven Foong, Product Development Engineer at Atotech in Singapore

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