Leadframe and connector
Integrated wet chemical process solutions for leadframes, connectors and bus bars, molded interconnect devices, cables and more
Quick facts
- Silver coatings and anti-tarnishes for power train
- Sweat resistant coatings for high end connectors
- Low whisker Sn deposits
- Unique adhesion promoters for copper, silver and Ni/Pd/Au surfaces
Applications
- ICs, discretes, power packages
- LED applications
- Metal wires & cables
- Molded interconnect devices
- Micro waveguides for 5G
Product portfolio
Leadframes
- Non Etching Adhesion Promoter (NEAP): innovative and cost effective solution for leadframes to meet highest reliability requirements
- Moldprep HMC: robust, industry proven and innovative patented solutions for copper alloy leadframe roughening for IC packages MSL enhancement
- Stannopure® PF 10: new tin plating process for IC outer leads with superb solderability and excellent coverage over entire current density range
- Anti-EBO T13: epoxy bleed out treatment to reduce the epoxy bleed out
- Silvertech HS: high speed silver spot plating process
Connectors, bus bars & wires
- Silvertech RBH: hard silver electrolyte for e-vehicle applications like power train bus bars and connectors
- Argalin® XL: high performance and temperature stable anti-tarnish for silver deposits
- Aurocor HSC: hard gold bath with excellent deposit properties and exceptional impurities tolerance; includes auxiliary additives that prevent gold immersion and overplating on masked areas reducing gold consumption
- Pallacor HSN Plus: high performance palladium nickel alloy plating with wide operating window and excellent high current density performance; uses lowest possible precious metal (Pd) to reduce initial make up and operating cost
- Rhodilloy 1000: Rh/Ru alloy for high end and sweat resistant coatings on ear phones and mobile phone chargers
- Stannopure® 100: high speed matt tin plating process for cables
ICS and Discretes
- Stannopure® 3000: matt tin plating process for high volume production process based on MSA
- Protectostan® Plus 3: green (PFAS free) postdip for tin to preserve solderability under steam or heat
- Deflash GR 1: efficient deflashing process to remove mold from outer leads
- Protectostan® LF2: post treatment for tin to mitigate corrosion whisker formation
LED Leadframe
- Silvertech HS LED: high speed and high brightness silver spot plating process
- Silvertech MS LED: robust process for bright silver deposits (full coverage)
- Argalin® K8: anti-tarnish to prevent brightness degradation
- Cupracid® LED Plus: bright acid copper for a smooth surface
Featured products
ppfPrep
Non-etching adhesion promoter (NEAP) for pre-plated leadframes
Silvertech® RBH
Hard silver deposit for connectors and bus bars
Adhesion promoters
Cost-effective reliability boosters for lead frame packages
Our new Adhesion promoters for advanced automotive applications provide a tight chemical connection between mold and metal. This in turn offers a sealed package that withstands longer exposures to heat and humidity.
“We are supporting manufacturers with high quality products that push the limits in reliability. Our custom-made metal plating processes, pre- and post-treatments, as well as adhesion promoters do exactly that, and therefore can make the difference”
Dr. Christian Ohde
Global Product Director for Lead Frame and Connector at Atotech Germany
