Leadframe and connector
Integrated wet chemical process solutions for connectors, leadframes and IC outer leads
Quick facts
- Full range of plating chemicals for gold alloy (nickel, iron, cobalt), palladium and palladium alloy, tin, nickel, copper, silver, rhodium, platinum and ruthenium coatings
- Full process range for superior pretreatments and post-treatments
- Sustainable solutions
Applications
- Electrical and electronic applications including IC outer leads, leadframes, connectors, and interconnect devices
- LED applications
- Micro waveguides
- Metal wires
Product portfolio
IC / leadframes
- Innovative solutions for leadframe roughening, tin plating, ultrathin Ni/Pd/Au and high-speed silver plating
- Highest MSL level performance
- Whisker prevention
- Low-to-zero free cyanide high-speed alternative for plating matt silver over leadframe surfaces
Connectors
- Innovative solutions for gold/gold alloy plating, palladium/palladium alloy plating, silver plating, nickel plating, tin plating and nickel gold plating
- Pure tin layers with low internal stress, excellent solderability and minimal propensity to whisker
- Robust systems allowing for wide variation within most significant plating parameters
Pretreatment
- Innvoative solutions for cleaning, anti-immersion and deflashing
- Processes for perfectly cleaned and activated metal surfaces
Post-treatment
- Innovative solutions for anti-discoloration and anti-tarnishing, anti-corrosion, bleed-out prevention, stripper and belt stripper
- Processes to inhibit discoloration of tin plated layers
- Excellent wettability and solderability of tin plated surfaces after steam aging and pressure cooking
Featured products
“We have carried out an extensive and methodical comparative study to evaluate and help visualize our deflashing performance. We have used the results to successfully develop the new Deflash GR1 process.”
Steven Foong
Product Development Engineer at Atotech Singapore
