Leadframe and connector

Integrated wet chemical process solutions for leadframes, connectors and bus bars, molded interconnect devices, cables and more

Quick facts

Highly conductive surfaces for e–vehicle applications
Sustainable tin products with low whisker propensity
Unique adhesion promoters for copper, silver and Ni/Pd/Au surfaces

Applications

Leadframe & IC
Connectors, busbars & cables
EV chargers & HV connectors
Tab leads & current collectors
Converters and inverters
Electrolyzers & fuel cells

Product portfolio

Leadframe & IC

[Cleaners] Puronon: Universal cleaner for RTR and LF applications designed for Cu, Cu-alloy and steel.
[Adhesion promotion] NEAP: Sustainable non-etching adhesion promotors for molds on all leadframe surfaces that improves leadframe reliability and stops IC package delamination.
[Chemical deflashing] Deflash: Designed to remove mold flash from outer leads.
[Tin plating] Green Tin: Processes with exceptional solderability and coverage, applicable for low to high speed plating tools with bright and matte finishes (free of BPA, NPE, PFAs and any other critical substances).
[Nickel plating] Ni Sulphamate HS and Novoplate HS: High speed hard nickel plating processes for corrosion and wear-resistant deposits.
[PdNi plating] Pallacor® HSN Plus: High performance palladium nickel alloy plating process with wide operating window and high current density performance that uses lowest possible precious metal (Pd) to reduce initial make up and operating cost.
[Silver plating] Silvertech and Argalux: High speed and versatile silver deposit processes with NC mod.
[Epoxy bleed out] Anti EBO T14: Reduces epoxy bleed out on substrate surfaces including copper, silver and pre-plated finishes.
[Post-treatment] Protectostan and SuperDip: Anti-tarnish solutions for tin and other leadframes.

Connectors, busbars & cables

[Tin plating (bright, matte & semi-matte] Green Tin: Full variety of tin plating processes including Green Tin with Stannopure®, Niveostan, Stannolume® and Stannacid®
[Ni, NiP & NiW plating] Novoplate: Highly corrosion and wear resistant nickel.
[Silver plating] Silvertech, Argalux® NC mod, Ag O-56: Hard silver electrolyte for e-vehicle applications like power train bus bars and connectors.
[Gold plating] Aurocor: Gold finishes with various properties.
[PPd, Rh, Ru plating] Pallacor®, Pallatech: Highly-efficient platinum metals plating.
[Post-treatment] Betatec, Argalin, Protectostan: Effective gold, silver and tin protection.

EV chargers & HV connectors

[Pre-treatment Cu] Puronon: Universal cleaner for RTR and LF application, designed for Cu, Cu-alloy and steel.
[Nickel plating] Novoplate : Highly corrosion and wear resistant nickel.
[Tin plating] Stannopure PF 10: Sustainable tin deposition and protection process with low whisker propensity.
[Hard silver plating] Silvertech and Argalux NC mod : Hard silver electrolytes for e-vehicle applications in connectors.
[Silver carbon plating] Silvertech C: Designed for increased durability and lubricating effect on contact surface – optimal solution for EV chargers.
[Silver protection] Argalin : Anti-tarnish solution for silver deposits.

Tab leads & current collectors

[NiP plating] Novoplate : High speed nickel palladium with Novoplate HS.
[Adhesion promotion & protection] Argalin family: Anti-tarnish solution for silver deposits..

Converters and inverters

[Copper pre-treatment] Descabase: Chemical etching process for copper alloys.
[Mold removal] Deflash: Designed to remove mold flash from outer leads.
[Adhesion promotion] NEAP: Sustainable non-etching adhesion promotors for molds on all leadframe surfaces that improve reliability and stops advanced package delamination.
[Anti epoxy bleed-out] Anti EBO: designed to reduce epoxy bleed out on substrate surfaces including copper, silver and pre-plated finishes..

Electrolyzers & fuel cells

[Platinum plating] Platinor: Platinum plating process designed to provide thin, pure, highly-conductive platinum deposits..
[Gold plating] Aurocor: High speed hard gold deposition with increased wear off resistance.
[Au on Ti] TiTech BP: High speed hard gold deposition with increased wear off resistance.

Featured products

ppfPrep

Non-etching adhesion promoter (NEAP) for pre-plated leadframes

Silvertech® C

Highest wear off performance for a longer life time

Stannopure® PF 10

High speed MSA based pure tin electrolyte for lead frames, connectors and wires

Protectostan® Plus 3

Perfect protection for tin deposits against heat and humidity

Cost-effective reliability boosters for lead frame packages

Our new Adhesion promoters for advanced automotive applications provide a tight chemical connection between mold and metal. This in turn offers a sealed package that withstands longer exposures to heat and humidity.

Green Tin

High-speed processes and post-treatments for lead frames and connectors

From matt over semi bright to bright tin deposits, Atotech is committed to fostering more sustainability throughout the working world and meeting changing requirements and regulations. Our portfolio of new and advanced, green tin plating processes and post-treatments provides optimal protection and coverage while being completely free of BPA, NPE, PFAs, or any other critical substances.