Leading surface pre-treatment

and post-treatment solutions

Our product portfolio

Leadframe and connector

Integrated wet chemical process solutions for leadframes, connectors and bus bars, molded interconnect devices, cables and more

Quick facts

  • Silver coatings and anti-tarnishes for power train
  • Sweat resistant coatings for high end connectors
  • Low whisker Sn deposits
  • Unique adhesion promoters for copper, silver and Ni/Pd/Au surfaces


  • ICs, discretes, power packages
  • LED applications
  • Metal wires & cables
  • Molded interconnect devices
  • Micro waveguides for 5G

Product portfolio

  • Non Etching Adhesion Promoter (NEAP): innovative and cost effective solution for leadframes to meet highest reliability requirements
  • Moldprep HMC: robust, industry proven and innovative patented solutions for copper alloy leadframe roughening for IC packages MSL enhancement
  • Stannopure® PF 10: new tin plating process for IC outer leads with superb solderability and excellent coverage over entire current density range
  • Anti-EBO T13: epoxy bleed out treatment to reduce the epoxy bleed out
  • Silvertech HS: high speed silver spot plating process
Connectors, bus bars & wires

  • Silvertech RBH: hard silver electrolyte for e-vehicle applications like power train bus bars and connectors
  • Argalin® XL: high performance and temperature stable anti-tarnish for silver deposits
  • Aurocor HSC: hard gold bath with excellent deposit properties and exceptional impurities tolerance; includes auxiliary additives that prevent gold immersion and overplating on masked areas reducing gold consumption
  • Pallacor HSN Plus: high performance palladium nickel alloy plating with wide operating window and excellent high current density performance; uses lowest possible precious metal (Pd) to reduce initial make up and operating cost
  • Rhodilloy 1000: Rh/Ru alloy for high end and sweat resistant coatings on ear phones and mobile phone chargers
  • Stannopure® 100: high speed matt tin plating process for cables

ICS and Discretes

  • Stannopure® 3000: matt tin plating process for high volume production process based on MSA
  • Protectostan® Plus 3: green (PFAS free) postdip for tin to preserve solderability under steam or heat
  • Deflash GR 1: efficient deflashing process to remove mold from outer leads
  • Protectostan® LF2: post treatment for tin to mitigate corrosion whisker formation

LED Leadframe

  • Silvertech HS LED: high speed and high brightness silver spot plating process
  • Silvertech MS LED: robust process for bright silver deposits (full coverage)
  • Argalin® K8: anti-tarnish to prevent brightness degradation
  • Cupracid® LED Plus: bright acid copper for a smooth surface

Adhesion promoters

Cost-effective reliability boosters for lead frame packages

Our new Adhesion promoters for advanced automotive applications provide a tight chemical connection between mold and metal. This in turn offers a sealed package that withstands longer exposures to heat and humidity.

“We are supporting manufacturers with high quality products that push the limits in reliability. Our custom-made metal plating processes, pre- and post-treatments, as well as adhesion promoters do exactly that, and therefore can make the difference”

Dr. Christian Ohde
Global Product Director for Lead Frame and Connector at Atotech Germany

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